São Paulo, comprising crucial industrial nodes such as the ABC Region, Campinas, and Guarulhos, represents the industrial heart of Brazil and Latin America. As a region experiencing rapid growth in advanced electronics assembly, pharmaceuticals, automotive control systems, and chemical manufacturing, the demand for highly reliable sealed packaging solutions has surged. Operating at the intersection of material science and electronic encapsulation, our products are engineered to withstand the unique high humidity and temperature variations of coastal and inland São Paulo.
Whether it is protecting solid-state power devices like Triacs and SCRs from micro-moisture intrusion in Campinas’ high-tech corridor, or supplying secure, odor-proof PET packaging solutions that conform to strict ANVISA (Agência Nacional de Vigilância Sanitária) regulatory guidelines, we are positioned as the definitive strategic partner. Our supply lines are optimized directly from our production facilities to the Port of Santos, ensuring uninterrupted manufacturing flows for localized assembly lines.
Our materials comply with regulatory frameworks such as RDC 17/2013 and GB standards, verifying structural and chemical safety for high-barrier storage.
Pre-cleared customs documentation matching Brazil's Receita Federal regulations to expedite clearance times and minimize warehousing overheads.
Our TO-220, TO-92, and TO-252 packages utilize advanced epoxy molding compounds (EMC) engineered to resist thermal cycles. By optimizing the glass transition temperature ($T_g$) and ensuring high adhesion to the copper lead frames, we mitigate the risk of interfacial delamination, which is a major driver of electrical failure in hot, humid climates like Brazil's coast.
For rigid and flexible physical packaging, we balance Moisture Vapor Transmission Rates (MVTR) and Oxygen Transmission Rates (OTR). Incorporating multi-layer co-extruded films and precise PET structures ensures that volatile organic compounds (VOCs) and sensitive chemical/botanical elements remain completely sealed inside, preserving active compounds.
Our TO-220F (Fullpack) and TO-220A packages are formulated with high thermal conductivity fillers. This enables optimal heat dissipation ($R_{\theta JC}$ reduction), protecting silicon junctions up to 150°C. This is highly suitable for industrial motor control systems deployed in heavy manufacturing plants across Guarulhos.
From a global perspective, the packaging sector is undergoing a profound paradigm shift towards sustainability and reliability integration. Supply chains are no longer looking for basic containment; they require active protection. In power electronics, this translates to packages that can withstand wide temperature swings and high current spikes (such as those seen in localized grid fluctuations). In retail and medical applications, it means child-resistant, smell-proof, and contamination-free barriers that maintain structural integrity during transit spanning thousands of miles.
Since 1985, Tongcheng Packaging Materials Co., Ltd. is a senior professional manufacturer in supplying flexible packaging by international standards. Our products exported to countries in Europe, America and Southeast Asia. The company covers a total area of 5500 square meters and has 7700 square meters for building. The company's registered capital is RMB 11.98 million Yuan. There are totally 150 lovely employees working together. Equipped with gravure plate making, printing, lamination, slitting, bag-making and film-blowing and testing areas, our annual production capacity reached 5000 tons.
We follow quality control systems of ISO22000 and GB 9683-1988 strictly to ensure quality. Based on this, our products are exported to clients all over the world. All these products are qualified after being tested by authentic systems. Our facilities are equipped with leading technological lines for co-extrusion, component mounting, and hermetic testing to verify zero-leakage profiles for both micro-electronic parts and polymer barriers.
The future of packaging in São Paulo revolves around two key pillars: environmental circularity and enhanced thermal/dielectric reliability. As the Brazilian market moves towards tighter ESG integrations, our R&D departments are focusing on developing high-barrier, mono-material PE/PP structures that are fully recyclable without compromising barrier efficacy. Concurrently, in power electronics packaging, we are refining our lead-free soldering profiles and transitioning to high-reliability molding compounds optimized for Silicon Carbide (SiC) and Gallium Nitride (GaN) power platforms.
Transitioning from traditional multi-layer non-recyclable laminates to high-barrier recyclable mono-material substrates that conform to standard European and Brazilian recycling systems.
Implementation of advanced substrate configurations inside TO-220 packages, enabling junctions to operate stably up to 175°C to handle heavy automotive loads in Brazilian transport corridors.
Integration of real-time batch-tracking solutions, providing full transparency from raw materials to delivery at warehouses in São Paulo.
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